- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
Patent holdings for IPC class H01L 25/18
Total number of patents in this class: 7799
10-year publication summary
|
398
|
430
|
461
|
611
|
736
|
876
|
928
|
1023
|
961
|
349
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 131630 |
592 |
| Mitsubishi Electric Corporation | 43934 |
540 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
445 |
| Intel Corporation | 45621 |
349 |
| Murata Manufacturing Co., Ltd. | 22355 |
324 |
| Fuji Electric Co., Ltd. | 4750 |
316 |
| Rohm Co., Ltd. | 5843 |
309 |
| Micron Technology, Inc. | 24960 |
303 |
| Kioxia Corporation | 9847 |
191 |
| Denso Corporation | 23338 |
161 |
| Yangtze Memory Technologies Co., Ltd. | 1940 |
125 |
| Samsung Display Co., Ltd. | 30585 |
122 |
| SK Hynix Inc. | 11030 |
114 |
| Sandisk Technologies LLC | 5684 |
114 |
| Sony Semiconductor Solutions Corporation | 8770 |
95 |
| Sumitomo Electric Industries, Ltd. | 14131 |
87 |
| Hitachi Automotive Systems, Ltd. | 3970 |
86 |
| Shindengen Electric Manufacturing Co., Ltd. | 774 |
84 |
| Hitachi, Ltd. | 16452 |
82 |
| Panasonic Corporation | 20786 |
80 |
| Other owners | 3280 |